Micron 2933 - Инструкция по эксплуатации - Страница 18

DRAM Operating Conditions

Recommended AC operating conditions are given in the DDR4 component data sheets.
Component specifications are available at micron.com. Module speed grades correlate
with component speed grades, as shown below.

Table 12: Module and Component Speed Grades

DDR4 components may exceed the listed module speed grades; module may not be available in all listed speed grades

Module Speed Grade

Component Speed Grade

-3G2

-062E

-2G9

-068

-2G6

-075

-2G3

-083

-2G1

-093E

Design Considerations

Simulations

Micron memory modules are designed to optimize signal integrity through carefully de-
signed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level. Mi-
cron encourages designers to simulate the signal characteristics of the system's memo-
ry bus to ensure adequate signal integrity of the entire memory system.

Power

Operating voltages are specified at the edge connector of the module, not at the DRAM.
Designers must account for any system voltage drops at anticipated power levels to en-
sure the required supply voltage is maintained.

I

DD

, I

PP

, and I

DDQ

 Specifications

I

DD

 and I

PP

 values are only for the DDR4 SDRAM and are calculated from values in the

supporting component data sheet. I

PP

 and I

DDQ

 currents are not included in I

DD

 cur-

rents. I

DD

 and I

DDQ

 currents are not included in I

PP

 currents. Micron does not specify

I

DDQ

 currents. In DRAM module application, I

DDQ

 cannot be measured separately be-

cause V

DD

 and V

DDQ

 use a merged power layer in the module PCB.

Certain I

DD

/I

PP

 conditions must be derated for optional modes of operation, such as CA

parity, DBI, write CRC, additive latency, geardown, CAL, 2X and 4X REF, and DLL disa-
bled. Refer to the base device data sheet I

DD

 and I

PP

 specification tables for derating val-

ues for the applicable die revision.

16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

DRAM Operating Conditions

CCMTD-1725822587-9899
asf18c2gx72pdz.pdf - Rev. H 7/19 EN

18

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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