Micron 2933 - Инструкция по эксплуатации - Страница 16

Electrical Specifications

Stresses greater than those listed may cause permanent damage to the module. This is a
stress rating only, and functional operation of the module at these or any other condi-
tions outside those indicated in each device's data sheet is not implied. Exposure to ab-
solute maximum rating conditions for extended periods may adversely affect reliability.

Table 9: Absolute Maximum Ratings

Symbol Parameter

Min

Max

Units

Notes

V

DD

V

DD

 supply voltage relative to V

SS

–0.4

1.5

V

1

V

DDQ

V

DDQ

 supply voltage relative to V

SS

–0.4

1.5

V

1

V

PP

Voltage on V

PP

 pin relative to V

SS

–0.4

3.0

V

2

V

IN

, V

OUT

Voltage on any pin relative to V

SS

–0.4

1.5

V

Table 10: Operating Conditions

Symbol Parameter

Min

Nom

Max

Units Notes

V

DD

V

DD

 supply voltage

1.14

1.20

1.26

V

1

V

PP

DRAM activating power supply

2.375

2.5

2.75

V

2

V

REFCA(DC)

Input reference voltage –
command/address bus

0.49 × V

DD

0.5 × V

DD

0.51 × V

DD

V

3

I

VTT

Termination reference current from V

TT

–750

–

750

mA

V

TT

Termination reference voltage (DC) –
command/address bus

0.49 × V

DD

 -

20mV

0.5 × V

DD

0.51 × V

DD

 +

20mV

V

4

I

IN

Input leakage current; any input excluding ZQ; 0V <
V

IN

 < 1.1V

–5

–

5

µA

5, 8

I

ZQ

Input leakage current; ZQ

–50

–

10

µA

6

I

OZpd

Output leakage current; V

OUT

 = V

DD

; DQ is High-Z

–

–

10

µA

7

I

OZpu

Output leakage current; V

OUT

 = V

SS

; DQ is High-Z;

ODT is disabled with ODT input HIGH

–50

–

–

µA

7

I

VREFCA

V

REFCA

 leakage; V

REFCA

 = V

DD

/2 (after DRAM is ini-

tialized)

–4.5

–

4.5

µA

8

Notes: 1. V

DDQ

 balls on DRAM are tied to V

DD

.

2. V

PP

 must be greater than or equal to V

DD

 at all times.

3. V

REFCA

 must not be greater than 0.6 × V

DD

. When V

DD

 is less than 500mV, V

REF

 may be

less than or equal to 300mV.

4. V

TT

 termination voltages in excess of specification limit adversely affect command and

address signals' voltage margins and reduce timing margins.

5. Command and address inputs are terminated to V

DD

/2 in the registering clock driver. In-

put current is dependent on termination resistance set in the registering clock driver.

6. Tied to ground. Not connected to edge connector.
7. Multiply by the number of module ranks and then times the number of die per package.
8. RCD input current

16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

Electrical Specifications

CCMTD-1725822587-9899
asf18c2gx72pdz.pdf - Rev. H 7/19 EN

16

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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