Micron 2933 - Инструкция по эксплуатации - Страница 17

Table 11: Thermal Characteristics

Symbol

Parameter/Condition

Value

Units

Notes

T

C

Commercial operating case temperature

0 to 85

°C

1, 2, 3

T

C

>85 to 95

°C

1, 2, 3, 4

T

OPER

Normal operating temperature range

0 to 85

°C

5, 7

T

OPER

Extended temperature operating range (optional)

>85 to 95

°C

5, 7

T

STG

Non-operating storage temperature

–55 to 100

°C

6

RH

STG

Non-operating storage relative humidity (non-condensing)

5 to 95

%

NA

Change rate of storage temperature

20

°C/hour

Notes: 1. Maximum operating case temperature; T

C 

is measured in the center of the package.

2. A thermal solution must be designed to ensure the DRAM device does not exceed the

maximum T

C

 during operation.

3. Device functionality is not guaranteed if the DRAM device exceeds the maximum T

C

 dur-

ing operation.

4. If T

C

 exceeds 85°C, the DRAM must be refreshed externally at 2X refresh, which is a 3.9µs

interval refresh rate.

5. The refresh rate must double when 85°C < T

OPER

≤

 95°C.

6. Storage temperature is defined as the temperature of the top/center of the DRAM and

does not reflect the storage temperatures of shipping trays.

7. For additional information, refer to technical note TN-00-08: "Thermal Applications"

available at micron.com.

16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

Electrical Specifications

CCMTD-1725822587-9899
asf18c2gx72pdz.pdf - Rev. H 7/19 EN

17

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